Site Sponsors
  • Strem Chemicals - Nanomaterials for R&D
  • Oxford Instruments Nanoanalysis - X-Max Large Area Analytical EDS SDD
  • Park Systems - Manufacturer of a complete range of AFM solutions

Ultratech Laser Spike Annealing Technology Selected as Primary Tool for Global 450-mm Consortium

Published on July 24, 2013 at 8:39 AM

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that its laser spike annealing (LSA) technology has been selected as a primary 450-mm millisecond annealing tool for the Global 450-mm Consortium (G450C), headquartered at SUNY's College of Nanoscale Science and Engineering (CNSE) in Albany, NY.

Utilized by leading IDMs and foundries around the globe, Ultratech's 300-mm LSA system is now implemented as the preferred technology for high-volume manufacturing of advanced logic devices from the 40- to 14-nm nodes. Built on the customizable Unity Platform™, the LSA's scanning system has fundamental advantages in uniformity and low-stress processing, which make it readily scalable to 450-mm applications. Ultratech will deliver its 450-mm LSA system for the G450C program's 450-mm equipment line in late 2013.

G450C is a public-private partnership announced by New York Governor Andrew M. Cuomo in September 2011 to facilitate the 450-mm wafer size transition. It is spearheaded by CNSE in partnership with Intel, IBM, GLOBALFOUNDRIES, Samsung and TSMC. The new 450-mm cleanroom is located at CNSE's Albany NanoTech Complex within the NanoFab Xtension (NFX) expansion.

Arthur W. Zafiropoulo, Chairman and Chief Executive Officer, stated, "LSA's advantages of low pattern effects, full-wafer temperature control, and low-stress processing have been demonstrated in high-volume manufacturing at 300mm, and now we will carry those same advantages to the 450-mm wafer size. Because LSA is a scanning system, it is quite straightforward to scale the system to larger wafer sizes, as compared to full-wafer processing systems. Furthermore, we are now seeing an increase in LSA applications beyond the ultra-shallow junction formation, and we expect this trend to continue as we move to smaller device nodes where 450mm will be adopted. With our flexible and extendible LSA product line, Ultratech is strategically positioned to meet its customers' advanced processing needs. We are very excited to be a part of the G450C program at CNSE, which is leading the industry transition to 450-mm technology as it ramps its 450-mm manufacturing line. The 450-mm LSA system is an example of our company's ongoing focus to provide cost-effective, leading-edge technology that enables competitive advantages for our global customers."

Paul Farrar Jr., CNSE Vice President for Manufacturing Innovation and General Manager of G450C, said, "Under the leadership and vision of Governor Andrew Cuomo, New York is firmly established as the hub for the critical industry transition to 450-mm wafer technology. We look forward to working closely with Ultratech and utilizing its capabilities to help enable the important transition to 450-mm technology."

Source: http://www.ultratech.com/

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Submit