Posted in | Nanoelectronics

STATS ChipPAC Partners with NTU to Develop Next Generation Semiconductor Packaging Technologies

Published on August 13, 2013 at 8:05 AM

STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, today announced a collaborative partnership with Nanyang Technological University (NTU) focused on generating breakthrough innovations in next generation packaging technologies.

STATS ChipPAC and NTU will collaboratively focus on further advancement in wafer level packaging and interconnect technologies, and the acceleration of research on new materials and manufacturing processes. The partnership leverages the depth of resources in NTU’s academicians and researchers, and STATS ChipPAC’s experience in advanced semiconductor packaging technologies.

Based in Singapore, NTU is one of the world’s fastest-rising universities, with globally acknowledged strengths in science and engineering. NTU recently ranked No. 2 amongst the world’s top young universities aged 50 years and below by higher education information provider Quacquarelli Symonds (QS). NTU is also ranked among Asia’s top 10 universities by QS. The university has made substantial contributions to Singapore’s drive for research and innovation, as well as attracting top students and some of the world's best professors. The partnership is in full alignment with STATS ChipPAC’s ongoing commitment to Singapore as the Company’s global hub for advanced wafer level technology research and development (R&D), and Post Wafer fab Process (PWfP) for advanced mobile convergence devices.

“The semiconductor industry is evolving rapidly to meet the increasing device complexity and connectivity experience of today’s electronic consumers. We are constantly seeking to expand our technology and manufacturing innovations in order to deliver differentiated solutions for our customers’ next generation mobile convergence devices. We are excited to collaborate with NTU to harness semiconductor technologies that will drive the next generation of electronic devices,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

“NTU continues to be the choice partner for industry leading companies, a key trait of a world-class, research-intensive university. NTU has an established track record in research and development with key industry players and through such partnerships, we turn fundamental research into innovation, leading to commercialisation. NTU’s collaboration with STATS ChipPAC provides a great opportunity for NTU faculty and post graduates to leverage on our strong research culture and expertise to develop advanced packaging solutions. By continuing to work in tandem with industry leaders such as STATS ChipPAC, we can continue to be an important engine for innovation in Singapore,” said Dr Lim Jui, Chief Executive Officer, NTU Innovation.

Source: http://www.statschippac.com/

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Submit