Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that Spreadtrum Communications, Inc., a leading fabless semiconductor provider with advanced technology in 2G, 3G, and 4G wireless communications standards, has selected the company’s Analog FastSPICE (AFS) Platform for characterization, analysis, and verification of its advanced mobile chipset platforms.
“Our integrated RF transceiver / baseband chipsets have stringent circuit verification requirements,” said Lon Christensen, General Manager, Spreadtrum Communications USA Inc. “We selected the AFS Platform because it delivers nanometer SPICE accuracy and has significantly improved the speed of simulations compared to a parallel SPICE simulator.”
The Analog FastSPICE Platform provides the world’s fastest circuit verification for nanometer analog, RF, mixed-signal, and custom digital circuits. Foundry certified to 20nm, the AFS Platform delivers nanometer SPICE accuracy 5x-10x faster on a single core and 2x-4x faster on multicore systems versus any other simulator. For circuit characterization, the AFS Platform includes the industry’s only comprehensive silicon-accurate device noise analysis and delivers near-linear performance scaling with the number of cores. For large circuits, it delivers >10M-element capacity, the fastest near-SPICE-accurate simulation, and the fastest, most accurate mixed-signal simulation. Available licenses include AFS circuit simulation, AFS Transient Noise Analysis, AFS RF Analysis, AFS Co-Simulation, AFS AMS, and AFS Nano SPICE.
“We are delighted that Spreadtrum Communications has adopted the AFS Platform for verification of their integrated RF transceiver / baseband chipsets.” said Ravi Subramanian, president and CEO of Berkeley Design Automation. “Integrating baseband, RF transceiver, power management, and other functions into a multi-mode multi-band solution is a tremendous design challenge. Spreadtrum’s selection further validates that Berkeley Design Automation is an essential partner to companies delivering advanced mobile chipset platforms for wireless communications.”