Posted in | Nanoelectronics

ENIAC JU Honors ‘Efficient Silicon Multi-Chip System-in-Package Integration’ Project with Innovation Award

Published on November 29, 2013 at 4:20 AM

The ENIAC Joint Undertaking announced that the project “Efficient silicon multi-chip System-in-Package integration – reliability, failure analysis and test (ESiP)” received the 2013 Innovation Award for demonstrating high quality and reliability for applications from consumer to aeronautics.

40 partners from 9 countries engaged total costs of 36.1 million euro to raise to the challenges posed by heterogeneous integration, developing technologies, analytical methods and characterisation techniques to create high value components integrating a variety of functions protected by anti-counterfeiting features.

Klaus Pressel, the project leader of Infineon Technologies, said: “Large companies and SMEs built in the ESiP project over 20 test vehicle, acquiring in-depth knowledge on the specific failure mechanisms, developing the appropriate analytical techniques and building highly reliable innovative solutions capable to satisfy the most demanding requirements.”

The project resulted in more than 130 technical publications.

Andreas Wild, the Executive Director of the ENIAC Joint Undertaking, said: “The ENIAC JU Innovation Award recognizes each year the projects having contributed most to building an innovation-based future of growth and jobs in Europe. ESiP, the winner of this year, created world-class system integration technologies effectively meeting societal challenges.”

Source: http://eniac.eu/

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