Oct 26 2015
Leading semiconductor test equipment supplier Advantest Corporation will promote its new TS9000 terahertz analysis systems for the semiconductor industry in Booth 619 at the International Microelectronics Assembly and Packaging Society conference in Orlando, October 27-29, 2015.
The TS9000 MTA is an innovative metrology tool that automates mold overlay thickness analysis for IC packaging using non-destructive pulsed terahertz radiation, while the TS9000 TDR uses short-pulse terahertz waves for analysis of electrical circuits in advanced semiconductors. The TS9000 is part of the company’s family of compact and multipurpose terahertz spectroscopic/imaging systems.
The TS9000 MTA sets a new standard in the semiconductor industry with its ability to perform mold thickness analysis of IC packaging, previously difficult to measure using conventional metrology. This “first-in-class” system enables rapid, repeatable and highly accurate measurements, even when analyzing the optically opaque mold polymer materials typically employed in IC packages. The flexible system handles die in strip or singulated units and is also fully compatible with industry-standard JEDEC trays. Non-contact and non-destructive, it can be configured for partial or 100% inspection of the product.
The TS9000 TDR, which utilizes short-pulse terahertz waves for analysis of electrical circuits, provides analysis of circuit errors with extremely high spatial precision of less than 5μm, and a maximum measurement range of 300 mm, including internal circuits such as through-silicon vias (TSVs) and interposers. Moreover, with the optional TDR/TDT CAD Data Link, errors located can be mapped and displayed on the CAD data of the target device, making it much easier for users to identify the causes of errors. The new technology overcomes the technical obstacles and prohibitive cost of existing technologies, and will contribute significantly to the development and wider adoption of these leading-edge devices.
Source: http://www.advantest.com/