International Corporation, one of the leading semiconductor foundries in
the world, today announced that it has successfully developed a 0.11 micron
CMOS image sensor (CIS) process technology. With this new production process,
SMIC-manufactured CIS devices exhibit improved resolution, low noise, and enhanced
image contrast for high performance CMOS imager applications.
SMIC offers complete CIS foundry service in China, and its CIS 0.11um capability
builds on its extensive experience in the field, giving customers a leading
edge solution at competitive costs while complementing its existing 0.18um and
0.15um CIS technologies. The 0.11um CIS technology, available with both aluminum
and copper backend metalization, for highly integrated, high density CIS solutions,
is ideal for a wide range of applications, including camera phones, computer
cameras, and industrial and security monitoring devices. SMIC has begun pilot
production for customers to take full advantage of this proven technology, which
can be manufactured on 200mm and 300mm wafers.
Paul Ouyang, SMIC vice president of marketing and sales said, "Using optimized
process conditions, we've successfully reduced dark noise, enabling performance
in low light environments. These features deliver to our customers a high performance
product at a reasonable cost, which allows them to enhance their competitiveness
and gain leading positions in an ever-growing CIS market."