Applied Materials,
Inc. today unveiled its Applied Centura® Silvia™ Etch system,
specifically designed to enable high-performance, low-cost, through-silicon
via (TSV) applications. In addition to delivering a higher silicon etch rate
and significantly lower operating costs than competitive systems, the Silvia
system's precise profile control enables the smooth, vertical via sidewalls
that are critical for the subsequent deposition of high-quality liner and fill
films. The highly flexible Silvia system can etch both silicon and oxide in
the same chamber, making it an ideal choice for established and emerging TSV
integration schemes.
“Via etch is a key process in TSV fabrication where multiple etch steps
can represent a significant portion of the total cost; therefore we have focused
on providing a system that overcomes the traditional etch rate/profile tradeoff
while significantly lowering the cost of ownership,” said Ellie Yieh,
vice president and general manager of Applied Materials’ Etch and Cleans
Business Unit. “The Silvia system is a natural extension of our long-standing
leadership in deep trench silicon etch &ndash with an installed base of
more than 200 chambers. Delivering high productivity, cost-efficient TSV etch,
the Sylvia system enables high quality, low cost, volume manufacturing for both
wafer fabs and packaging houses.”
The Silvia system’s uncompromising performance is achieved with Applied’s
proprietary time-multiplexed gas modulation (TMGM) process. While conventional
TMGM processes etch vias with heavily scalloped sidewalls that are difficult
to fill, the Silvia system achieves smooth, vertical profiles at the rapid etch
rates required for high productivity manufacturing.
The Silvia system’s exceptional profile control accommodates a broad
range of TSV schemes, each with different challenges. In the via-first scheme,
the Silvia system provides the required profile control and high selectivity
to photoresist for etching very small, deep holes with very smooth sidewalls.
The Silvia system is equally well-equipped to meet the demands of via-last schemes,
which are performed by packaging and semiconductor customers where cost of ownership
(COO) is critical. The Silvia system delivers the lowest COO through low-cost
consumables and a high reliability platform design that has been proven over
a decade of high-volume manufacturing.
For more information on the Applied Centura Silvia Etch system, please visit:
www.appliedmaterials.com/products/silvia_etch_4.html.