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3M和EV集團解決晶圓鍵合技術專利糾紛

Published on December 28, 2008 at 7:56 PM

3M和EV集團(EVG)已同意和解EVG 3M公司在美國地方法院對紐約南區有關臨時晶圓接合系統所帶來的專利侵權訴訟。

根據和解條款,其中的細節是保密的,3M公司,其客戶,3M公司3M公司的晶圓支持系統的特許供應商將繼續進行,銷售和使用晶圓支持系統,在全球半導體和包裝市場。 EVG將繼續捍衛其專利組合,並保護其知識產權。

Last Update: 7. October 2011 02:26

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