SUSS MicroTec, supplier
of innovative solutions for 3D Integration, Advanced Packaging, MEMS, Nanotechnology
and Compound Semiconductor markets, and iX-factory, a leading expert for single
wafer production and technical services, announced today that they are closely
cooperating on microfludics and integrated optical applications. iX-factory
develops its technologies on equipment platforms that include the newly launched
MA/BA8 Gen3 mask and bond aligner and the CB8 wafer bonder from SUSS MicroTec.
The MA/BA8 Gen3 represents the latest development of SUSS MicroTec’s
manual aligner platform. Its unmatched alignment precision coupled with high
resolution and maximum light uniformity makes it the system of choice for a
variety of applications ranging from MEMS and 3D Packaging to micro-optics and
nanotechnology. The CB8 high performance wafer bonder complements the mask and
bond aligner offering excellent pressure uniformity and a unique vacuum-isolated,
multi-zone heater. The CB8 supports all standard MEMS packaging bonding applications,
such as eutectic, fusion, and metal diffusion bonding.
“Mask aligner and bonder technology from SUSS MicroTec meet our high
performance requirements by combining first class quality and precise performance
with high versatility and ease of use.” Dominique Bouwes, CEO of iX-factory
GmbH comments. “As an integral partner, SUSS MicroTec strengthens our
ability to meet the full spectrum of our customers’ advanced micro and
nano technology needs.”
“We are proud to play an important role in the continuous education and
exploration of the MEMS and nanotechnology field ”, said Rolf Wolf, General
Manager for the Lithography Division at SUSS MicroTec. “Partnering with
iX-factory provides SUSS MicroTec with the challenging opportunity to further
expand its technological leadership in the MEMS and nanotechnology market.”