NanoPore, Incorporated was founded in 1993 with the purpose of commercializing high porosity/high surface area materials for a wide range of applications including adsorbtion, gas separation, advanced...
Torr International, Inc., incorporated in 1989, is a specialist in Thin Film and Nanotechnology.
Torr’s products include Magnetron Sputtering, Electron Beam and Thermal Evaporation...
Anatech USA delivers high vacuum systems with graphic state-of-the-art, "Touch-Panel" intuitive control packages. Every effort is made to tailor the system to meet your needs and budget...
Honeywell Electronic Materials is a leading materials supplier to the semiconductor industry and adjacent marketplaces. Backed by the power of Honeywell, a $30 billion industrial powerhouse,...
Nanometrix Inc. has announced a breakthrough in ultra thin "photo resist" and dielectrics for semiconductors. They have has been successful in producing films of photo resist on silicon wafers ¡Ü 25nm...
http://www.azonano.com/article.aspx?ArticleID=1441 | 21 Nov 2005
The processing that is required to lower the dielectric constant in a low-k film has the adverse effect of degrading the mechanical properties of the film. This article examines mechanical properties...
http://www.azonano.com/article.aspx?ArticleID=2896 | 8 Jun 2011
Nanophase Technologies now have available zinc oxide nanomaterials in commercial quantities. Properties and application of the NanoArc Zinc Oxide materials are provided. Posted November 8 2004
http://www.azonano.com/article.aspx?ArticleID=1069 | 24 Nov 2004
This article features a typical example of a complete test carried out with the Nano Scratch Tester (NST) from CSM Instruments on a hard dielectric coating
http://www.azonano.com/article.aspx?ArticleID=1800 | 4 Dec 2006
The J.A. Woollam Company was founded in 1987 by Dr. John A. Woollam. Starting
as a spin-off from the University of Nebraska, the J.A. Woollam Company has
rapidly grown to become a worldwide...
IMEC presents innovations
in dielectrics and metallization technologies as well as in their integration
approaches. Great progress has been obtained in the metallization of 22nm interconnects,...
http://www.azonano.com/news.aspx?newsID=12572 | 14 Jul 2009