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Nano-Additives Improve the Performance of Electroplated Metals

PlasmaChem’s nano-additives (DiamoSilb® and AlumoSilb®) lead to the formation of smaller metal crystallites (and a smaller distance between crystallites) during the electroplating process. As a...

http://www.azonano.com/article.aspx?ArticleID=2999 | 18 Apr 2012
New Report Focuses on Electroplating in Nanotechnologies

Research and Markets has announced the addition of John Wiley and Sons Ltd's new report "Modern Electroplating, 5th Edition" to their offering. The definitive resource for electroplating, now...

http://www.azonano.com/news.aspx?newsID=20678 | 24 Nov 2010
Dynatronix, Integran Extend Cooperation in Nanomaterial Electroplating Field

Integran Technologies (Toronto, ON) and Dynatronix, Inc. (Amery, WI) are pleased to announce that they have entered into a co-operative sales and marketing agreement. This agreement will further...

http://www.azonano.com/news.aspx?newsID=25864 | 2 Nov 2012
Enduro Extends License Term for Integran’s Nanocrystalline Cobalt Electroplating Process

By Gary Thomas PTC Alliance’s subsidiary, Enduro Industries has extended its license exclusivity term for Nanovate CoP, a nanocrystalline cobalt electroplating process developed by Integran...

http://www.azonano.com/news.aspx?newsID=24825 | 10 May 2012
Pratt + Whitney Canada Licenses Integran’s Nano Cobalt Electroplating Process

By Cameron Chai Pratt & Whitney Canada based in Montreal has licensed Integran Technologies’ nano cobalt electroplating process (Nanovate CoP) to deploy as a replacement for hard chromium...

http://www.azonano.com/news.aspx?newsID=24553 | 28 Mar 2012
Novellus Introduces Advanced Copper Electroplating System for 22nm Technology Node and Beyond

Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and defect density performance for the 22nm...

http://www.azonano.com/news.aspx?newsID=14243 | 20 Oct 2009
Innovative Copper Seed Provides Bottom-up Fill That Reduces The Pre-Electroplating Aspect Ratio

Novellus Systems (NASDAQ:NVLS) announced today that it has developed an advanced Hollow Cathode Magnetron (HCM®) IONX(TM) PVD copper seed process that will enable copper interconnects below...

http://www.azonano.com/news.aspx?newsID=12516 | 13 Jul 2009
Benefits of Thermal Spray, CVD, PVD, Electroplating and Surface Engineering Technology

To communicate the benefits of thermal spray and surface engineering technology to a new audience of potential users -- including mechanical, chemical and electrical engineers and designers --...

http://www.azonano.com/news.aspx?newsID=8387 | 29 Oct 2008
New Electroplating System Drives Interconnect Technology Beyond the 90nm Barrier

Applied Materials, Inc. introduces its 300mm SlimCell(TM) electrochemical plating (ECP) system that overcomes the limitations of existing plating technology to deliver a cost-effective,...

http://www.azonano.com/article.aspx?ArticleID=270 | 5 Dec 2003
A Glance into LIGA's Prospering Future

Over the past decades, many applications have been proposed as commercially viable for LIGA (Lithographie, Galvanoformung, Abformung (Lithography, Electroplating, and Molding)). This paper will give a...

http://www.azonano.com/article.aspx?ArticleID=2770 | 23 Jan 2011

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