PlasmaChem’s nano-additives (DiamoSilb® and AlumoSilb®) lead to the formation of smaller metal crystallites (and a smaller distance between crystallites) during the electroplating process. As a...
http://www.azonano.com/article.aspx?ArticleID=2999 | 18 Apr 2012
Research and Markets has announced the addition of John Wiley and Sons Ltd's new report "Modern Electroplating, 5th Edition" to their offering.
The definitive resource for electroplating, now...
http://www.azonano.com/news.aspx?newsID=20678 | 24 Nov 2010
Integran Technologies (Toronto, ON) and Dynatronix, Inc. (Amery, WI) are pleased to announce that they have entered into a co-operative sales and marketing agreement.
This agreement will further...
http://www.azonano.com/news.aspx?newsID=25864 | 2 Nov 2012
By Gary Thomas
PTC Alliance’s subsidiary, Enduro Industries has extended its license exclusivity term for Nanovate CoP, a nanocrystalline cobalt electroplating process developed by Integran...
http://www.azonano.com/news.aspx?newsID=24825 | 10 May 2012
By Cameron Chai
Pratt & Whitney Canada based in Montreal has licensed Integran Technologies’ nano cobalt electroplating process (Nanovate CoP) to deploy as a replacement for hard chromium...
http://www.azonano.com/news.aspx?newsID=24553 | 28 Mar 2012
Novellus Systems (NASDAQ: NVLS) today
introduced the SABRE Excel, an advanced copper electroplating system designed
to provide industry-leading fill and defect density performance for the 22nm...
http://www.azonano.com/news.aspx?newsID=14243 | 20 Oct 2009
Novellus Systems (NASDAQ:NVLS)
announced today that it has developed an advanced Hollow Cathode Magnetron (HCM®)
IONX(TM) PVD copper seed process that will enable copper interconnects below...
http://www.azonano.com/news.aspx?newsID=12516 | 13 Jul 2009
To communicate the benefits of thermal spray and surface engineering technology
to a new audience of potential users -- including mechanical, chemical and electrical
engineers and designers --...
http://www.azonano.com/news.aspx?newsID=8387 | 29 Oct 2008
Applied Materials, Inc. introduces its 300mm SlimCell(TM) electrochemical plating (ECP) system that overcomes the limitations of existing plating technology to deliver a cost-effective,...
http://www.azonano.com/article.aspx?ArticleID=270 | 5 Dec 2003
Over the past decades, many applications have been proposed as commercially viable for LIGA (Lithographie, Galvanoformung, Abformung (Lithography, Electroplating, and Molding)). This paper will give a...
http://www.azonano.com/article.aspx?ArticleID=2770 | 23 Jan 2011