Article - 26 Mar 2004
Fujitsu Ltd has announced it will build a 160 billion yen plant at its site in Mie Prefecture, Japan to produce logic LSI (large-scale integration) chips. Posted March 19 2004
News - 6 Mar 2015
IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for...
News - 2 Jun 2011
Researchers at the Lawrence Berkeley National Laboratory of the U.S. Department of Energy (DOE) have developed nanoscale waveguides for advanced on-chip optical communication systems.
Xiang Zhang, a...
News - 6 Jul 2009
Recognized academic and technical experts in nanoelectronics from the College of Nanoscale Science and Engineering ("CNSE") of the University at Albany have been selected to deliver...
News - 31 Aug 2007
GmbH, manufacturer of thin film thermoelectric devices,
announces a significant technology advancement in its ultra-small,
microchip thermoelectric coolers (TECs). The new MPC-D303...
News - 18 Jun 2014
A new flexible and energy-efficient hybrid circuit using carbon nanotubes has big implications for the future of electronics
When it comes to electronics, silicon will now have to share the...
News - 7 May 2013
A team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for...
News - 29 Oct 2012
IBM scientists have demonstrated a new approach to carbon nanotechnology that opens up the path for commercial fabrication of dramatically smaller, faster and more powerful computer chips.
News - 15 Nov 2010
STMicroelectronics (NYSE: STM), a leader in automotive ICs and in MEMS (Micro-Electro-Mechanical Systems) sensors, has introduced a new family of high-g acceleration sensors for advanced airbag...
News - 21 Jun 2010
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), today announced their entry into a 3-way cooperation to advance 3D IC...