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Results 1 - 10 of 73 for Wafers
  • EVG540 Automated Wafer Bonding System from EV Group
    Equipment
    EVG540 Automated Wafer Bonding System is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging,...
  • DXB Wafer Bonder from Dynatex International
    Equipment
    The DXB is used for mounting wafer to substrate improves bond quality and repeatability while improving process time during lapping, polishing, or dicing.
  • SST International MODEL 3180/3190 Wafer Bonders
    Equipment
    The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.
  • SB6/8e Semi-Automated Wafer Bonding System from SÜSS MicroTec AG
    Equipment
    The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class...
  • alpha300 Semiconductor Edition – Raman imaging microscope for large wafer inspection
    Equipment
    This product profile describes the features and applications of the alpha300 Semiconductor Edition Raman microscope for chemical imaging.
  • TXRF Spectrometer for Ultra-Trace Element and Contamination Analysis
    Equipment
    Discover more about contamination analysis of wafers and electronics using TXRF.
  • Cleaving Kit with Mat
    Equipment
    This is the exhaustive tool kit for scribing and cleaving cleanly. This process is crucial for creating the highest quality cross-sections. This kit contains two diamond scribes for marking and...
  • The Cleaving Station with Mat
    Equipment
    The Cleaving Station contains a 12x18” self-healing cutting mat, two diamond scribes to use for marking and scribing, one pen style diamond scribe and pliers for cleaving. It also includes all items...
  • The Cleaving Station without Mat
    Equipment
    The Cleaving Station contains two diamond scribes to use for marking and scribing, one pen style diamond scribe and pliers for cleaving. It also includes all items in the Wafer Cleaving Kit...
  • Cleaving Kit without Mat
    Equipment
    This is the exhaustive tool kit for scribing and cleaving cleanly. This process is crucial for creating the highest quality cross-sections. This kit contains two diamond scribes for marking and...

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