Keteca USA is the leading manufacture of wafer dicing surfactant worldwide. We have factories located in Arizona and our headquarters in Singapore with full test labs in both locations. We are an ISO 9001 certified company with experience in all types of material dicing and grinding. Our dicing surfactant eliminates saw particles, reduces chipping and increases blade life and feed speeds of cutting. We also manufacture our own line of dispensing systems and can design and manufacture for different needs. Our high mix ratios make us the affordable solution to bring your dicing to the next level.
Keteca USA also manufactures 2” hub style saw blades for dicing most types of materials. We manufacture standard and custom size, grit blades. We will work with you to find the perfect blade for your application. We focus on total customer satisfaction for small and large dicing operations.
We offer quick lead times, low pricing all made in the USA.