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Current research is focused on understanding the electrical properties of metal nanoparticle based devices, fabricated using a combination of wet-chemical techniques and high-resolution e-beam lithography. It is anticipated that these devices could find application in systems ranging from sensors to logic and memory components, where their ultra-small size and low power consumption can be exploited to produce a new generation of high-density electronics. The current approach involves three distinct steps, each of which is currently being investigated: synthesis of metal nanoparticles and the linker molecules that bind them to surfaces, chemical self-assembly of the nanoparticles onto the surface of the devices, and characterization of the final structures both chemically and electrically.