Endicott Interconnect Technologies, Inc. a world leader in high-performance electronics packaging solutions, design, manufacture, test, and deliver printed circuit board fabrication, semiconductor packaging fabrication, and complex assembly solutions. Their technology can be found in the world's fastest supercomputers, life-saving medical devices, complex imaging systems, mission-critical defense applications and thousands of other products, throughout the world.
The customer base include IBM, Cadence, Cisco, Boeing, Northrop Grumman, Raytheon, St. Jude Medical, GE Medical, Harris, DE Shaw, and the U.S. Department of Defense.
With a humble beginning in 2002 as the successor to IBM’s microelectronics division in Endicott, N.Y. (formed in 1966) they have grown to a 1,400-strong team of scientists, engineers, and innovators that spreads across three continents.
Company's goal is to remain at the forefront of continued technological advancement and their scientists and engineers collaborate with universities, research institutes, and customers to create industry-defining solutions, to innovate and challenge the technological landscape, and to generate fundamental change in our everyday lives.