Innovion provides outsource ion implantation to the microelectronic industry. Ion implantation is a critical process step in the manufacture of every integrated circuit device including microprocessors, application specific integrated circuits (ASIC’s), power management devices, telecom devices, wireless and broadband devices, mechanical electrical micro systems (MEMS) and a whole new generation of devices such as Silicon On Insulator (SOI), vertical stacked cavity emitting lasers (VCSEL’s) for fiber optic switching networks, and silicon carbide based devices for the creation of blue light emitting diodes (Blue LED’s) for both low power color displays and the generation of ultra low power white light.
The Innovion strategic plan calls for the establishment of long term contracts for the processing of the ion implantation step and for the removal of the customer’s existing tool set into a series of regional implant "centers of excellence" in key geographic areas of semiconductor production. This benefits the customer immediately as the removal of the tools frees up valuable fab floor space for other processes that are constraining the fabs production capabilities. Ion implant tools occupy 25-35% of typical fab floor space in a wafer fab. If this space could be reclaimed by the removal of implanters to a regionally located Innovion "implant center", productivity of the customers existing fab could be increased by 30-50% without the huge capital expenditures required for today’s modern fab construction that can exceed $1000/ft2.