Silicon and Nitride Wafer Products for MEMS, TEM and X-Ray Spectroscopy

Topics Covered

Giant Piezo MEMS (GPM) Technology
Silicon Wafers
Research and Development
About University Wafer


University Wafer offer a broad range of MEMS products, including nitride membrane windows and standard super thin silicon membranes for the TEM, SEM and X-ray spectroscopy research community.

The product range offered includes standard silicon nitride TEM window grid with the following specifications:


  • 5nm
  • 10nm
  • 20nm
  • 50nm

Frame thickness

  • 100µm
  • 200µm

University Wafer also has the capability to fabricate custom TEM grids, x-ray windows and other suspended membrane chips to meet the customer’s unique specifications, with rapid turnaround and low engineering costs.

Giant Piezo MEMS (GPM) Technology

The patented microscale GPM technology at the heart of the Giant Piezo MEMS Deformable Mirror applies breakthrough innovation to familiar deformable mirror technologies. GPM-based deformable mirrors add unique value, by leveraging manufacturing processes and materials and integrating MEMS and ASICs.

Giant Piezo MEMS technology features a large blocking force for mirror actuation, large stroke, low voltage, proven Si MEMS durability and high mirror surface figures.

The Digital ASIC Backplane's all-digital circuitry offers extreme power efficiency that approximates theoretical limit, as well as increased reliability and low cost.

Silicon Wafers

Very thin silicon wafers are manufactured using a speciality polymer for temporary wafer bonding, in contrast to conventional wafer attachment using tapes.

This allows the silicon thickness to be greatly reduced. University Wafers offers super-thin silicon wafers with thicknesses from 5µm to 100µm, in diameters from 1” to 6”.

The thin silicon wafers are void-free, haze-free, and have a low surface RMS of around 1 to 2nm and a very low TTV (typically less than +/-1µm).

Thin silicon wafers are also offered attached with a rigid wafer ring. The wafer-ring setup facilitates handling of the super thin silicon and can be easily mounted to custom lab fixtures.


University Wafer offers a variety of wafer processing services, including:

  • Wafer dicing
  • Silicon wafer lapping and polishing to 5-50µm super thin thickness
  • Wafer bonding to mate a cavity wafer with a bare wafer
  • PECVD Nitride, LS Nitride, Oxide, and LS Oxide on Silicon including super thin Silicon wafers
  • Ebeam and thermal evaporation of metal coating (Ti, Cr, Au. Pt, Pd, Al, Cu, Ag, etc.) on Silicon wafers including super thin Silicon
  • IC assembly (wafer dicing, die attachment, wire bonding, flip chip bonding)

Research and Development

University Wafer's interdisciplinary R&D team has worked with partners in academia and the biochemical industry, to investigate the technical feasibility of several potential MEMS/NEMS applications. The are aiming to identify disruptive, high value MEMS/NEMS solutions in such areas as:

  • Lab-On-Chip ELISA
  • Micro Counter
  • Micro-Cantilever Sensing and Actuation Components
  • Photo Dynamic Therapy Laser
  • Light Engine for Portable Information Display, and
  • Dynamic Diagnostics Tools for Light Emitting Devices

About University Wafer

University Wafer was developed to provide researchers with wafers and other semiconductor related materials and services inexpensively and in a timely manner.

University Wafers supplies wafers ranging from as thin as 5 microns to as thick as a silicon ingot, and are able to supply single wafers or orders of any size. Most of our silicon items are in stock or can ship in just a few short weeks to any destination.

Wafers can have oxides, nitrides, or metals deposited on their surface. They can be diced, and thinned to 5um. Undoped, low doped and highly doped wafers are always in stock.

This information has been sourced, reviewed and adapted from materials provided by University Wafer.

For more information on this source, please visit University Wafer.

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