Micro-Electro-Mechanical Systems integrate both mechanical and electrical components on a single chip. Hence, the characterization of the mechanical as well as electrical properties is needed for reliable testing of MEMS
Application Example: In-Plane and Out-of-Plane MEMS Stiffness Testing
In-plane and out-of-plane compression testing is executed for the accurate measurement of the mechanical stiffness of suspended structures on a MEMS chip. Using the FT-MTA03 Micromechanical Testing and Assembly System, a force is applied vertically onto each of the suspended structures while the resulting deformation is recorded. The spring linearity, stiffness, repeatability and hysteresis of the MEMS structure can be measured from the resulting force-versus-deformation data. The force has to be applied inside a small gap during the in-plane testing. Hence, the FT-S-LAT Lateral Microforce Sensing Probe is employed. The geometry of this probe allows the contacting tip to be placed inside the small gap and apply a horizontal force.
Application Example: Fatigue Testing of MEMS Structures
The FT-MTA03 Micromechanical Testing and Assembly System can be employed for fatigue testing in order to evaluate the failure and lifetime of movable MEMS structures. For this purpose, a cyclic load (force-controlled) is subsequently applied to the suspended structure and the deformation is measured. Any changes in the material (for example, the initiation or propagation of cracks) can be detected through continuous monitoring of the ensuing force-versus-deformation data.
This information has been sourced, reviewed and adapted from materials provided by FemtoTools AG.
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