Vion™ PFIB from FEI

The Vion™ Plasma Focused Ion Beam System (PFIB) adds significantly more capacity to your lab with best-in-class milling and imaging performance in a single, easy-to-use instrument.

It increases throughput over conventional gallium-based FIB by more than 20 times for site-specific, cross-sectional milling and large region of interest preparation for other analytical techniques.

Vion Plasma Focused Ion Beam for Materials Science

Especially well-suited for metals, composites and coatings, the Vion PFIB supports a range of materials characterization, failure analysis and sample preparation applications.

  • Create site-specific cross sections quickly
  • Achieve greater milling speed without sacrificing quality for large area and repetitive milling projects, as well as for low sputter rate materials like steel
  • Perform fast, site-specific micromachining of structures and surfaces for dynamic compression or tensile testing
  • Prepare high quality, site-specific surfaces for Electron Back Scattered Diffraction analysis
  • Prepare specimens for other imaging and characterization techniques like SEM and TEM
  • Gain sub-30 nm image resolution for quick identification and metrology of thin layers and structures.

Vion Plasma FIB for Electronics

  • Failure analysis of bumps, wire bonds, TSVs, and stacked die
  • Surgically remove material to enable failure analysis and fault isolate on buried die
  • For process monitoring and development at die/package level
  • Defect analysis of packaged parts and MEMS devices

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