Posted in | Ellipsometers

Fast and Precise Thin Film Measurement with the SENresearch 4.0

The latest development within SENTECH metrology portfolio is the SENresearch 4.0 Each of those spectroscopic ellipsometers has a customer-specific spectral range configuration.

The SENresearch 4.0 spectroscopic ellipsometer is designed with the broadest spectral range, from 190 nm deep UV to 3,500 nm NIR. With FTIR ellipsometry, a high spectral resolution is provided to examine even thick films up to 200 µm thickness.

During data acquisition, there are no moving optical parts in order to acquire the best measurement results. The Step Scan Analyzer (SSA) principle is a special feature of the  SENresearch 4.0 spectroscopic ellipsometer. The extended version of the SSA principle is possible with the innovative 2C design, and it enables a complete measurement of the Mueller matrix. The 2C design is one of the  cost-effective and field upgradable accessories.

The SpectraRay/4 software package is full-featured used for progressive material analysis. It includes the Recipe Mode for routine applications and the Interactive Mode for exploration with a guided graphical user interface.

The SENresearch 4.0 makes use of a rapid FTIR ellipsometry for the NIR that ranges up to 2500 nm or 3500 nm, respectively. It offers the widest spectral range with excellent S/N ratio and maximum spectral resolution with selection option. The FTIR ellipsometry measurement speed is comparable with diode array configurations, which can also be selected up to 1700 nm.

The new motorized Pyramid Goniometer includes an angle that ranges between 20° and 100°. Optical encoders guarantee long term stability and maximum precision for the angle settings. The spectroscopic ellipsometer arms can be moved freely for angle resolved transmission and scatterometry measurements.

The SSA principle of the  SENresearch 4.0 decouples the intensity measurement from mechanical movement, allowing rough samples to be tested. The SENresearch 4.0 incorporates a rapid measurement mode for in situ and mapping applications.

Key Features:

  • Configuration is possible for both advanced and standard applications
  • Capable of measuring silicon films up to 200 µm in thickness
  • Predefined recipes are offered for a wide range of applications

Applications:

  • Textured surfaces
  • Structural 3D anisotropic samples
  • Dielectric layer stacks
  • Optical anisotropic samples

Other Equipment by this Supplier