The TRAK series plasma system offers excellent plasma treatment quality and automation in a single, very configurable platform, resulting in high-throughput plasma processing and plasma cleaning for electronics as well as semiconductor packaging. Based on the configuration of the chamber kit and electrode, the plasma chamber can perform several processes such as photoresist descum/ash, oxide removal, organic contamination clean, dielectric etch, and surface activation.
Automated and manual operations (with inline or integrated handler), remote user interface, SMEMA, and SECS/GEM communications protocol are aided by the TRAK systems. The chamber design is versatile, compact, and remarkably uniform, facilitating interchangeable processing arrangements and plasma modes such as direct, RIE, downstream, and IFP (ion-free plasma) plasma treatment options.
Owing to a three-axis symmetrical plasma chamber, all positions of the product are consistently treated while tight controls across all process parameters ensure repeatable results from one product to the next.
- The general architecture of the TRAK system can deal with a broad range of product form factors, such as boats, carriers, Jedec/Auer® boats, strips, wafers, and laminates
- The TRAK’s proprietary plasma process control and small plasma chamber volume enable unmatched short cycle times, while its slim structure decreases floor space requirements
- Owing to a proprietary algorithm, maximum power to the chamber is attained rapidly; this algorithm continually measures forward and reflective power inside the chamber.
- Based on throughput and product form requirements, the TRAK system can be set up for magazine-to-magazine processing of both single and multiple lead frames or strips, wafer processing, and even standalone for island-based production settings
- The SMART® Tune management system in the TRAK provides closed-loop plasma control that enhances the RF system and decreases the tuning time. Furthermore, the system automatically recycles to a plasma-ready state, counterbalancing any variations in vacuum pressure, temperature, and varied lot sizes.
Features and Benefits
- Can be easily combined with a range of process equipment, such as wire bond, die attach, mold, marking, and dispense
- Ultimate application flexibility for direct, downstream and ion-free (patented) plasma, which enables treatment without exposure to UV and ion
- Industry-leading throughput capacity with short cycle times
- Slim structure reduces floor space requirements, and all service parts can be effortlessly accessed from the front
- Proprietary process control and compact, three-axis symmetrical chamber for exceptional process consistency
Models and Configurations
FlexTRAK™ Plasma Treatment System: The standard configuration meets the plasma treatment and plasma cleaning necessities of innovative semiconductor and electronic packaging.
FlexTRAK™-S Plasma Treatment System: This model is specially built for processing larger substrates, and comprises of a large-capacity plasma chamber, 9.24 liter, or twice the capacity of a regular FlexTRAK.
FasTRAK™ Plasma Treatment System: This is a 100% automated, high-throughput, plasma treatment system designed mainly for lead-frame strips, laminate substrates, and other strip-type microelectronic parts. Since recipes are stimulated by software and the system requires minimal hardware tooling or interaction, it is easy to swap to a new magazine or strip size. The system almost removes the need for operator handling of the magazines or strips.
FlexTRAK™ 2MB Plasma Treatment System: This system is built for high-throughput, inline processing of microelectronic devices that are held in boats, trays, or other carriers. It is ideal for pre-Flip-Chip Underfill (FCUF) processes. Unique boat bypass feature improves productivity, and throughput is increased through many inline plasma modules and production-ready twin-lane boat handling.
FlexTRAK™ CD and FlexTRAK™ CDS Plasma Treatment Systems: The system is specially engineered for high-throughput processing of lead frame strips, laminated substrates, and other strip-type electronic components. The CD can accommodate up to five strips per plasma cycle, while the CDS, with a longer plasma chamber, can handle up to 10 strips per plasma cycle. Through this process, the parts are returned back into the same magazine; users can refer to the FasTRAK system for various handling processes.