High Viscosity Demold Resin for Hologram Printing: DM57

Stensborg has introduced a high-viscosity photoresist demold resin called DM57. This fast and acrylate-based UV curing resin has been specifically developed for use on Stensborg’s Roll-2-Plate (R2P) and Roll-2-Roll (R2R) micro/nano imprint holoprinters.

Product Features

Developed as a high-viscosity fast curing resin, the DM57 can be used with both iron-doped mercury lamps and LEDs (365–405 nm).

Technical Data Sheet of DM57

Source: Stensborg

Type Acrylate-based UV curing demold resin
Viscosity Very high: 850 cP at a temperature of 25 °C
Typical curing dose ~70 mJ/cm2


Suggested Applications

The DM57 resin has been developed as a photoresist demold resin for creating working masters (WM) for the DeskTop HoloPrinter. It can be used with numerous other photoresists, for instance, the Shipley Mircoposit S1800 series photoresist.

The DM57 works very well with the imprint replication resins such as DM41 and DM56 and also with replication resins such as X29 and X30.


After curing, the DM57 fixes on to an array of substrates including, but not limited to, PC, PVC, and PET. It should be noted though that treatment of the substrate surface, or lack, is likely to have an impact on the DM57’s adhesion properties.

Storage and Handling


Appropriate protective gear, goggles, and protective gloves should always be worn when handling the DM57 resin. The standard procedures intended for handling chemicals should also be followed as per the resin’s material safety data sheet (MSDS).


The shelf life of the DM57 resins is at least 12 months from the date of manufacture, if stored in their original containers, at temperatures from 5 °C to 25 °C and kept away from direct sunlight.

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