The High-Speed 3D CT Tomography inspection system from SEC automatically inspects product defects in a customer’s line.
The system can resolve issues related to overlapped X-ray images, thus accurately inspecting all kinds of defects in double-sided PCBA and BGA-mounted components. It offers an inspection rate of 3.5 seconds per FOV from loading to automatic good/NG judgment.
Features
- High-speed 3D In-Line Inspection System (~3.5 sec/FOV)
- Best Solution for both-side layered PCB
- Various defects detectable - BGA, Chip component and etc.
- Application : Sensor/ECU/Application Processor/PKG Chip/Automotive
Specifications
Source: SEC
Image Credit: SEC