The Nano-focus X-ray Inspection System from SEC is equipped with a Nano-focus Tube of 200-nm resolution, which is dedicated to semiconductor packaging and wafer level packaging (WLP), where sub-micron defects need to be detected.
The system can accurately trace and inspect damaged areas by precisely moving the axis with an anti-vibration table.
Wafer bump automatic inspection is available throughout Oblique CT / Cone Beam CT.
Features
- Non-destructive analysis system for wafer level packaging
- High-resolution image with dual-type CTs
- Application Processor, RAM, PKG Chip, Wafer Level
Specifications
Source: SEC
*Options: Wafer stage, Detector Change/Additional Installation
** Options: EFEM installation for Wafer, AXI Program
Image Credit: SEC