Park Systems has launched the innovative
Park 3DM Series, the fully automated AFM system built for high-resolution sidewall imaging, overhang profiles and critical angle measurements. With the patented decoupled XY and Z scanning system with tilted Z-scanner, it overcomes the challenges of the normal and flare tip methods in accurate sidewall analysis. In utilizing Park Systems True Non-Contact Mode™, the Park 3DM Series enables non-destructive measurement of soft photoresist surfaces with high aspect ratio tips.
A fully automated industrial AFM using NX technology
Clean room compatible and fully automated for measurement and data analysis at the nanoscale level
True Non-contact™ mode allows for the collection of high resolution and accurate data without tip-sample damage, something that could otherwise cost you valuable time and money
NX technology automatically constructs a very accurate topographical image and gathers crucial dimensional data
The Industry leading, low noise Z-detector works on an autonomous, closed loop to reduce errors in topography (the “creep effect”)
Innovative head design for undercut and overhang structures
Z-head’s distinctive sideways orientation allows access to the undercut and overhang structures of photoresist and other industrial material
Patented decoupled XY and Z scanning systems function together with the tilted Z-scanner, allowing users to overcome common challenges in accurate sidewall analysis linked with normal and flare tip techniques
Sidewall trench line profile, critical angle, roughness and critical dimension can all be measured using the NX-3DM
Z-head tilting mechanism allows access to the sidewalls using an ultra-sharp tip to acquire the same high resolution and definition as is gained over the rest of the material
A Reliable, Seamless Measurement Tool for 3D materials
No sample preparation (eg. mounting, cutting or coating) is needed to attain the sidewall roughness or critical dimension measurements in this process
By using Z-head tilting and True Non-contact™ mode, the NX-3DM allows for both tip-preserving and high resolution gathering of sidewall data
Undercut and Overhang Profiling
NX-3DM allows unique access to the overhang and undercut structures of photoresist and other industrial materials, guaranteeing users receive accurate topographical data across the entire sample.
Images taken at three different tilting angles can be stitched to combined together automatically to form a complete 3D image
Critical Dimension Measurement
The True Non-Contact Mode enables instrument and subject-preserving CD measurement without compromising image fidelity.
Photoresist dense lines pattern is imaged with 3D AFM, the profile matches with SEM image very well.
Sidewall Roughness Measurement
The NX-3DM’s novel head tilting design allows access to the sidewalls using an ultra sharp tip to achieve high resolution, clear details of the area and its roughness. The innovative head tilting design permits access to the sidewalls using ultra sharp tip to acquire high resolution and (more defined) details of the side wall roughness.
3D AFM image provide high resolution profiles for bottom, sidewall and top of the photoresist line, which can be used for LER/sidewall roughness analysis of the structure Park 3DM features
Innovative Z-Scan System
The numerous unique features of the
NX-3DM are made possible by autonomously tilting the Z-scanner in its patented Crosstalk Eliminated platform, where XY and Z scanners are fully decoupled. This design allows users to access the vertical sidewalls as well as theundercut structures at a range of angles. In contrast with systems with flared tips, here high aspect ratio and high resolution probes can be used.
Flexure-Guided XY Scanner with Closed-loop Dual Servo System
The 100 µm x 100 µm XY scanner comprises of a symmetrical 2D flexure stage and high-force piezoelectric stacks that offer highly orthogonal movement with minimum out-of-plane motion, as well as the high responsiveness necessary for precise sample scanning at the nanometer scale. Two symmetric, low-noise sensors are present on each axis of the XY scanner to retain a high level of orthogonality in the context of large scanning ranges and sample sizes. The secondary sensor corrects and compensates for non-planar and non-linear positional errors which might happen using a single sensor alone.
Automatic Measurement Control for Increased Efficiency
The NX-3DM is provided with automated software that makes operation seamless. Just choose the preferred measurement program to obtain precise multi-site analysis and auto-optimized settings for scan rate, cantilever tuning, gain and set-point parameters. Park's user-friendly software interface offers users the flexibility to produce customized operation routines so that they can make the most of the NX-3DM with the slightest amount of effort. Creating new routines is simple. On average it takes only 10 minutes to create a new routine and less than five to alter an existing one.
Industry Leading Low Noise Z Detector
Park Systems’ AFMs are provided with highly effective low noise Z detectors in the field, with a noise of 0.2 Å over large bandwidth. This creates highly accurate sample topography, no need for calibration and no edge overshoot. Just one of the numerous ways the Park NX-3DM saves time and offers better data.
Accurate Sample Topography Measured by Low Noise Z Detector
No artifact by AFM scanner in low noise closed-loop topography
Needs calibration, performed only once at the factory
Uses low noise Z detector signal for topography
Has no edge overshoot at the leading and trailing edges
Has low Z detector noise of 0.02 nm over large bandwidth
Industry’s Lowest Noise Floor
To detect the smallest sample features, and image the flattest surfaces, Park has engineered the industry’s lowest noise floor specification of < 0.5 Å. The noise floor data is established using a “zero scan.” The system noise is measured with the cantilever in contact with the sample surface at a single point under the following conditions:
0.5 gain in contact mode
0 nm x 0 nm scan, staying at one point
256 x 256 pixels
Gauge Repeatability and Reproducibility
As a result of the ever-decreasing size of components, manufacturers now require the maximum level of quality control. Park AFM can offer 1 gauge sigma of less than 1 Å.
Due to Park's innovative AFM platform designed for industrial metrology, Park NX-3DM will correlate with any current Park AFMs that have been formerly used for inspection, manufacturing, analysis or research.
A revolutionary all-in-one system for 3D Metrology
Automatic Tip Exchange (ATX)
The ATX automatically locates tips by pattern recognition and uses a novel magnetic method to disengage a used tip and pick up a new tip, with an amazing 99.9% success rate. The laser spot is then automatically optimized along the X- and Y-axis by motorized positioning knobs.
Automatic Wafer Handler (EFEM or FOUP)
NX-3DM can be configured for a range of automatic wafer handlers, such as FOUP and EFEM. The high-precision, robotic handling arm guarantees users get rapid and reliable wafer measurements every time.
Ionization System for a more stable scanning
Park Systems’ innovative ionization system rapidly and effectively eliminates electrostatic charges in the sample’s environment. Since the system always produces and maintains the suitable balance of positive and negative ions, it can develop a very stably charged environment with negligible contamination from the surrounding area and reduce the risk of accidental electrostatic charge during sample handling.
Park NX-3DM Specifications
Motorized XY stage
200 mm: travels up to 275 mm × 200 mm, 0.5 µm resolution
300 mm: travels up to 400 mm × 300 mm, 0.5 µm resolution, < 1 µm repeatability
Motorized Focus Stage
9 mm Z travel distance for on-axis optics
Motorized Angle Range
-19 degrees and +19 degrees
-38 degrees and +38 degrees
< 0.5 degree angle repeatability
Motorized Z Stage
27 mm Z travel distance
0.08 µm resolution
< 1 µm repeatability
Z Scanner Range: 15 µm (large mode) 2 µm (small mode)
Z Scanner Resolution: 0.016 nm (large mode) 0.002 nm (small mode)
Z Scanner Noise Floor: < 0.05 nm
Z Scanner Detector Noise: 0.02 nm @ 1 kHz
COGNEX Pattern Recognition
pattern align resolution of 1/4 pixel
Single-module flexure XY scanner with closed-loop control
100 µm × 100 µm (Large mode)
50 µm × 50 µm (Medium mode)
10 µm × 10 µm (Small mode)
XY Scanner Resolution
0.28 nm (Large mode)
0.03 nm (Small mode)
Room Temperature (Stand By)
10 °C ~ 40 °C
Room Temperature (Operating)
18 °C ~ 24 °C
30% to 60% (not condensing)
Floor Vibration Level
VC-E (3 µm/sec)
Below 65 dB
Vacuum : -80 kPa
CDA (or N 2): 0.7 MPa
Power Supply Rating
208V - 240 V, single phase, 15 A (max)
Total Power Consumption
2 KW (typical)
Below 100 ohms
Dimensions & Weight
200 mm System
1500 mm(w) × 980 mm(d) x 2050 mm(h)
w/o EFEM, 1020 kg approx. (incl. Control Cabinet)
2465 mm(w) × 1000 mm(d) x 2050 mm(h)
w/ EFEM, 1230 kg approx. (incl. Control Cabinet)
2500 mm or more
Operator Working Space
3300 mm (w) x 2300 mm (d), Minimum
300 mm System
1840 mm(w) × 1170 mm(d) x 2050 mm(h)
w/o EFEM, 1320 kg approx. (incl. Control Cabinet)
3260 mm(w) × 1350 mm(d) x 2050 mm(h)
w/ EFEM, 2120 kg approx. (incl. Control Cabinet)
2500 mm or more
Operator Working Space
4540 mm (w) x 2850 mm (d), Minimum
Park NX-3DM 300mm installation layout