The Zeta™-300 optical surface metrology tool offers multiple measurement modes with integrated acoustic isolation to reduce the effects of sound and air currents on surface measurements. When gathering data on structures that are less than 1µm high, even small vibrations caused by sound and air disturbances can affect the results. Coupled with an optional isolation table, the Zeta-300 delivers accuracy and repeatability unmatched by other optical profilers, and is designed to support both R&D and production environments.
Flexible Hardware & Software Options
In research, it is often unpredictable as to what type of surface will need to be measured. With this in mind, the Zeta-300 offers a modular design that allows for a wider range of hardware measurement options as well as software packages:
- Film Thickness Spectrometer
- DIC/Nomarski for nanometer-scale roughness
- Bright-field and Interferometric objectives
- Piezo stage for 3 nm z-resolution
- Tilt stages, sample holders and vacuum chucks
- Automatic feature detect/measure software
- Automatic surface area calculation, statistical analysis
- ...and much more!
User Testimonial
The diversity and speed of the KLA are unmatched qualities of this system that make it indispensable in the lab. The customer service is fast and helped us even with the most unique and special requests we had, including personal software updates.
Florian Stumpf, Fraunhofer Institute IISB, Germany
Application-Specific Metrology
The Zeta-300 surface metrology tool supports multiple applications, including those listed below:
LED, PSS & PEC Analysis
- Auto Height, Diameter & Pitch for PSS
- Analyze photoresist or post-etch PSS bumps
- Auto feature detect, roughness for post-epi mesa analysis
- 2”, 4” & 6” wafer vacuum chucks
Solar Cell and Wafer Analysis
- Auto Finger Height, Width & Volume
- Poly-Si and Mono-Si Surface Area & Texture
- Silicon-Nitride AR Film Thickness
- Multi-site and auto finger detect
- 156mm solar wafer vacuum chuck
Microfluidics and MEMS analysis
- Transparent multi-surface profiling of both open and closed channels
- Deep trench/well & high aspect ratio feature profiling
- Programmable cursors and cross-sections
Ease-of-Use Features
- Multi-site sequencing and multi-FOV 3D image stitching with auto-stage option
- Auto-slope and waviness compensation
- Auto-surface leveling
- Auto-feature height, dimensions, angle, area
- Auto-linear and areal roughness