The EVG540 Automated Wafer Bonding System is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications. Based on modular design the EVG540 provides a proven solution for later transition of wafer bonding processes from R&D stage to large-scale manufacturing on our fully integrated production bonding systems.
Features of the EVG540 Automated Wafer Bond System
- Fully-automated processing with automated loading and unloading bond chucks
- Single chamber production bonder
- Automatic handling of up to four bond chucks
- Compliant to high safety standards
- Modular bond chamber design
- Active bottom side cooling
Specifications of the EVG540 Automated Wafer Bond System
- Heater size = Max. wafer diameter: 150 mm, 200mm, 300mm
- Min. wafer diameter: 150mm heater: 50mm; 200mm heater: 100mm, 300mm heater: 200mm
- Bond chuck system / Alignment system:
- 150mm heater: EVG620, EVG6200, IQ Aligner, SmartView
- 200mm heater: EVG6200, IQ Aligner, SmartView
- 300mm heater: IQ Aligner, SmartView
- Max. contact force: 3.5kN, 7kN, 10 kN, 20 kN, 40 kN, 60 kN
- Max. temperature: 550°C (600°C optional)
- Vacuum: 1E-3 mbar (standard), 1 E-5 (optional), vacuum controller and process gas lines optional
- Power supply for anodic bonding: 0-2.000V / 50mA
- Loading chamber: 3-axis robot
- Process (recipe) compatible with GEMINI
- Max. number of bond chambers: 1
- Customer / application: pilot-line +manufacturing, high volume manufacturing