Plasma & Thermal ALD System: FlexAL

Oxford Instruments’ FlexAL systems offer a new range of capability and flexibility in the fabrication of nanoscale structures and devices by providing remote plasma atomic layer deposition (ALD) processes and thermal ALD inside a single ALD system.

Key Features

The main features of the FlexAL systems are:

  • Automatic 200 mm load lock for process flexibility
  • Can be configured for both production and R&D environments
  • Cassette-to-cassette handling increases output suitable for production
  • Clusterable for vacuum transfer of substrates
  • Controllable, repeatable processes through recipe-driven software interface
  • Hex handler with robot and 25 wafer cassette for 100, 150 or 200 mm wafers (no tools needed to swap between wafers)
  • Low damage retained for using remote plasma
  • Low-temperature processes enabled by plasma ALD
  • Remote plasma and thermal ALD in single flexible tool
  • Utmost flexibility in the selection of materials and precursors
  • All configurations can be entirely placed inside the cleanroom or through-the-wall
  • Ability to manage from small wafer pieces up to complete 200 mm wafers
  • Can be incorporated in cluster system with other process tools, including the company’s PlasmaPro 100 range of deposition and etch tools
  • Integral ports allows the addition of in-situ ellipsometry measurement instruments
  • Internal glove box on precursor modules for in-situ exchange
  • Load-locked wafer entry designed for low particle count as well as short loading-to-process-start time
  • Licensed technology from ASM International NV

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