FEI Electronics Business
Industry-leading FEI electronics workflows deliver fast, accurate answers for accelerating integrated circuit (IC) design and production decisions. In the lab or in the fab, integrated imaging and analysis provide superior images, rich feature sets, cross-sectional metrology, and automation to speed process defect identification, enable root-cause analysis, reduce yield loss, and accelerate time-to-market for new products.
Our experts engage with your applications, engineering, and manufacturing teams to address today’s challenges, while our leadership and significant R&D commitment are paving the way to 15-nanometer technologies and beyond. More customers trust FEI to help them deliver next-generation computing and storage products.