Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI and SEHK: 0981.HK) today announced that it will extend its 45-nanometer bulk complementary metal-oxide semiconductor (CMOS) technologies to 40nm and 55nm geometries.
These new processes will complement SMIC's existing offerings to better support customer demand worldwide, including in the fast-growing China market. Applications include multimedia products, graphics chips, chipsets, and mobile devices such as handsets integrated with 3G/4G.
"Our 45nm technology has been implemented at SMIC's 300mm facility in Shanghai ahead of schedule and we look forward to a similar result at these additional geometries," said SMIC's President and CEO, Dr. Richard Chang. "These new offerings provide our current and new customers a customized set of solutions to meet their diverse product design-in needs."
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35um to 45nm. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, a 200mm fab under construction in Shenzhen, and an in-house assembly and testing facility in Chengdu. SMIC also has customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation.
Posted on October 14th, 2009