Posted in | News | Nanoelectronics

Process Qualification Enables Dual Sourcing by X-FAB UK and X-FAB Sarawak for Ample Capacity

X-FAB Silicon Foundries, the world's leading foundry for the production of analog/digital integrated circuits, today announced that its Malaysian facility in Kuching, Sarawak, Malaysia – with its modern 200 mm production line – now is fully qualified for volume production and second sourcing of the company's 0.35 micrometer high-voltage process technology called XH035. This process technology is ideal for a wide variety of applications including RF and power management, low-power and high-precision mixed-signal circuits, analog front-ends for sensors, mixed-signal embedded systems, systems-on-chip (SoCs) and automotive applications.

The flexible XH035 CMOS technology can be expanded easily with a full range of add-on modules including three- and four-layer metallization, a second gate-oxide for transistors with varying breakdown voltages of up to 50 Volts, well isolated 3.3 and 5-Volt transistors, and EEPROM storage blocks. Full front- and back-end modularity creates a lean process flow and optimizes the number of mask layers. The process also meets the rigorous AEC-Q100 standard for automotive applications.

The XH035 process comes with a large variety of active and passive devices to address analog/mixed-signal design needs. These devices include high-voltage NMOS, PMOS and DMOS transistors, double-poly and MIM capacitors, high-ohmic and low-TC resistors. In addition, the process offers excellent matching, low on-resistance high-voltage devices and embedded NVM options. It also features a variety of dense standard cell libraries optimized for area, speed, low power or low noise; and I/O libraries, including ESD support and numerous verified analog IP libraries.

In addition, RF CMOS building block extensions are available for applications up to 2.4 GHz, for Bluetooth, WLAN and ISM transmitters/receivers.

The next process extension, already in the Conditional Release development phase, will offer a very compact single poly EEPROM cell 30-percent smaller than the current EEPROM, and with two fewer mask layers. Designs and risk production can be started now on this extended process version.

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    X-FAB Dresden GmbH + Co. KG. (2019, February 15). Process Qualification Enables Dual Sourcing by X-FAB UK and X-FAB Sarawak for Ample Capacity. AZoNano. Retrieved on April 17, 2024 from https://www.azonano.com/news.aspx?newsID=7422.

  • MLA

    X-FAB Dresden GmbH + Co. KG. "Process Qualification Enables Dual Sourcing by X-FAB UK and X-FAB Sarawak for Ample Capacity". AZoNano. 17 April 2024. <https://www.azonano.com/news.aspx?newsID=7422>.

  • Chicago

    X-FAB Dresden GmbH + Co. KG. "Process Qualification Enables Dual Sourcing by X-FAB UK and X-FAB Sarawak for Ample Capacity". AZoNano. https://www.azonano.com/news.aspx?newsID=7422. (accessed April 17, 2024).

  • Harvard

    X-FAB Dresden GmbH + Co. KG. 2019. Process Qualification Enables Dual Sourcing by X-FAB UK and X-FAB Sarawak for Ample Capacity. AZoNano, viewed 17 April 2024, https://www.azonano.com/news.aspx?newsID=7422.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.