Apr 14 2009
CRAIC Technologies, the leading manufacturer of UV-visible-NIR microscopes and microspectrometers, is pleased to announce the QDI 2010 Film microspectrophotometer. The QDI 2010 Film instrument is designed to measure the thickness of thin films of sub-micron sampling areas rapidly and non-destructively.
Able to analyze films of many materials on both transparent and opaque substrates, the QDI 2010 Film™ enables the user to determine thin film thickness on everything from semiconductors, MEMS devices, disk drives to flat panel displays. When combined with CRAIC Technologies proprietary contamination imaging capabilities, the QDI 2010 Film™ represents a major step forward in that it is designed specifically for industrial processes.
"Many of our customers want to measure the thickness of thin films of smaller and smaller sampling areas for rapid quality control of their products. The QDI 2010 Film™ microspectrophotometer was built in response to customer requests for a powerful, flexible film thickness tool that can measure sub-micron areas on both transparent and opaque substrates. The QDI 2010 Film™ meets those needs" says Dr. Paul Martin, President.
The complete QDI 2010 Film™ solution combines advanced microspectroscopy with sophisticated software to enable the user to measure film thickness by either transmission or reflectance of many types of materials and substrates. Due to the flexibility of the CRAIC Technologies design, sampling areas can range from over 100 microns across to less than a micron. Designed for the production environment, it incorporates a number of easily modified processing recipes, the ability to create new film recipes and sophisticated tools for analyzing data. The ability to directly image and analyze films with ultraviolet microscopy can also be added to this instrument.