Posted in | News | MEMS - NEMS | Nanobusiness

Tegal Receives Additional Order from EU-Based MEMS Manufacturer

Tegal Corporation, (Nasdaq: TGAL) an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order for an additional Tegal 4200 SE™ DRIE cluster tool process module from a leading EU-based supplier of MEMS and Power IC devices.

The Tegal 4200 SE DRIE process module will be shipped and installed at the customer’s site in the next fiscal quarter, and will add to the customer’s overall production capacity for high volume manufacturing of MEMS and Power IC devices.

The Tegal 4200 SE cluster tool silicon DRIE process module order from this repeat Tegal DRIE customer follows the successful installation, process qualification, and sustained use of silicon Deep Reactive Ion Etch processes on the customer’s first Tegal 4200 SE cluster tool PM.

“Our customer is known for their technological leadership in the MEMS and Power IC markets, and we see this repeat order as confirmation of the Tegal silicon DRIE tool’s superior performance in high volume manufacturing,” said Yannick Pilloux, DRIE Product Manager at Tegal Corporation. “We believe that our DRIE process modules are the most reliable and most advanced on the market and, as this repeat order shows, we have been able to meet our customer’s demanding technical requirements for silicon DRIE cluster tools, while providing excellent value along the way.”

The Tegal 4200 SE™ is an advanced, world-class cluster tool system dedicated to Deep Reactive Ion Etch applications. Featuring an inductively coupled plasma etch reactor and magnetic plasma confinement, the tool can run Tegal’s patented SHARP – Super High Aspect Ratio Process, achieving etched feature aspect ratios of >100:1 in production environments. The Tegal 4200 cluster tool can be configured with up to 4 process modules, and 2 cassette modules, for High Volume Manufacturing applications for the most frequently used materials in MEMS and semiconductor device fabrication: Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2)

Tegal silicon DRIE tools are presently employed in numerous research and development laboratories throughout the world, engaging in both commercial and academic research programs, and are also found in MEMS foundries and other dedicated commercial High Volume Manufacturing lines world-wide.

Source: http://www.tegal.com/

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Collabrx, Inc.. (2019, February 13). Tegal Receives Additional Order from EU-Based MEMS Manufacturer. AZoNano. Retrieved on April 19, 2024 from https://www.azonano.com/news.aspx?newsID=17932.

  • MLA

    Collabrx, Inc.. "Tegal Receives Additional Order from EU-Based MEMS Manufacturer". AZoNano. 19 April 2024. <https://www.azonano.com/news.aspx?newsID=17932>.

  • Chicago

    Collabrx, Inc.. "Tegal Receives Additional Order from EU-Based MEMS Manufacturer". AZoNano. https://www.azonano.com/news.aspx?newsID=17932. (accessed April 19, 2024).

  • Harvard

    Collabrx, Inc.. 2019. Tegal Receives Additional Order from EU-Based MEMS Manufacturer. AZoNano, viewed 19 April 2024, https://www.azonano.com/news.aspx?newsID=17932.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.