Article - 22 Nov 2009
A nanostructured material is nowadays a broad term used to refer to materials that have been either patterned or have structural features in the nanometer (nm) scale.
News - 16 Jun 2010
Veeco Instruments Inc. (Nasdaq: VECO) announced today the introduction of the NEXUS(R) TAMR Physical Vapor Deposition (PVD) System for next-generation Thermal Assisted Magnetic Recording (TAMR), also...
News - 27 Nov 2008
At the 14th International Conference on Thin Films (ICTF 14) in Belgium last week LayTec has presented the latest results of on-line deposition rate measurements in sputter processes. Dr. Steffen...
News - 25 Jan 2016
Picosun Oy, the leading supplier of high quality ALD (Atomic Layer Deposition) thin film coating solutions for industrial production, has revolutionized cost-effective MEMS manufacturing with high...
News - 6 Mar 2013
LiqTech International, Inc. ("LiqTech") is pleased to announce that the Company has launched a new state-of-the-art Silicon Carbide (SiC) Flat Sheet Membrane (FSM) disc for Membrane...
News - 17 Sep 2011
Steam purification company RASIRC has declared that it has presented a poster on the benefits of water vapor utilization over ozone in the atomic layer deposition (ALD) process at the 26th European...
News - 18 Apr 2011
Picosun, a Finland-based global developer of Atomic Layer Deposition (ALD) systems, has started manufacturing plasma enhanced ALD (PEALD) systems from ‘ion-free remote plasma sources.
News - 23 Nov 2010
CEA-Leti will present 10 papers, including two invited papers, at the IEDM/IEEE 2010 International Electron Devices Meeting Dec. 6-8, in San Francisco, Calif.
The two invited papers include an...
News - 29 Apr 2010
Oxford Instruments Plasma Technology (OIPT), leader in systems for etch, deposition and growth, has recently received a multi-system order from the University of Waterloo, Ontario, Canada for...
News - 1 Mar 2010
The Supervisory Council of RUSNANO has authorized financing for a project titled Establishment of Production of Panels with High Thermal Conductivity for Assembly of Bright Light-Emitting Diodes Based...