News - 6 Aug 2014
Research and Markets has announced the addition of the "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update" report to their offering.
Through Silicon Vias...
News - 29 Jul 2014
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, today announced new quality benefits for fan-in...
News - 23 Jul 2014
If you’re allergic to dust mites (and chances are you are), help may be on the way.
Researchers at the University of Iowa have developed a vaccine that can combat dust-mite allergies by...
News - 7 Jul 2014
USHIO INC. (President and CEO: Shiro Sugata) today announced that at SEMICON West 2014 (Booth #2105) the company will exhibit a series of its lithography tools for advanced packaging applications,...
News - 28 May 2014
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, today introduced encapsulated Wafer Level Chip...
News - 14 May 2014
Berkeley lab researchers find that viral packaging motor rotates DNA and adapts to changing conditions, information that could help future drug designs
Viruses are the enigma of the biological...
News - 9 May 2014
MIT researchers have devised a novel cancer treatment that destroys tumor cells by first disarming their defenses, then hitting them with a lethal dose of DNA damage.
In studies with mice, the...
News - 30 Apr 2014
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the Mask Aligner MA12 today.
This semi-automated tool is...
News - 23 Apr 2014
Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs...
News - 7 Apr 2014
Research and Markets has announced the addition of the "Nanotechnology in Packaging Trends" report to their offering.
Nanotechnology is emerging as a promising technique for the packaging...