Article - 2 Jul 2010
Interest in nanoparticles has risen in recent years, but one problem has remained; what is the “best” way to determine the size of these materials?
News - 4 Nov 2009
By means of thin film technology a reduction of size, cost, and power consumption of electronic circuits can be achieved. The required specifications are attained by proper design and combinations of...
News - 6 Jul 2016
Graphene has emerged as one of the most promising two-dimensional crystals, but the future of electronics may include two other nanomaterials, according to a new study by researchers at the University...
News - 5 Aug 2015
UC Berkeley researchers have discovered a new way to switch the polarization of nanomagnets, paving the way for high-density storage to move from hard disks onto integrated circuits.
News - 25 Feb 2016
The Cornell NanoScale Science and Technology Facility (CNF), a leading university research facility located at Cornell University, Ithaca, NY, and Oxford Instruments Plasma Technology (OIPT), UK have...
News - 1 Aug 2008
A multi-institutional team of scientists has used beamline 9.0.1 at the Advanced Light Source to perform high-resolution x-ray diffraction imaging of an aerogel for the first time, revealing its...
News - 16 Jun 2010
Veeco Instruments Inc. (Nasdaq: VECO) announced today the introduction of the NEXUS(R) TAMR Physical Vapor Deposition (PVD) System for next-generation Thermal Assisted Magnetic Recording (TAMR), also...
News - 26 Jun 2014
QuantumClean® and ChemTrace® today announced that they will be exhibiting at the SEMICON West tradeshow, held at the Moscone Center in San Francisco from July 8th through the 10th,...
News - 28 Jun 2011
A Charles Godfrey Binder professor of engineering science and mechanics at Penn State, Akhlesh Lakhtakia, collaborated with engineers from the National Taipei University of Technology to formulate a...
News - 10 Sep 2009
MIT materials scientists have developed a new technique for growing carbon nanotubes that could replace the vertical wires in chips, permitting denser packing of circuits.