AIXTRON AG today announced an order for its QXP-8300 ALD deposition tool from a major Taiwanese foundry. The order is for a 300MM system for the deposition of next generation high-k materials by Atomic Layer Deposition (ALD). The order was received in the first quarter of 2010 and the system will be delivered in the second half of this year.
Dr. Sasangan Ramanathan, Chief Technical Officer at AIXTRON Inc., commented that “This order validates the uniqueness of our patent protected TriJet precursor delivery methodology for next generation high-k materials for high volume manufacturing.”
The QXP-8300 drives the performance of ALD to the next level by exploiting the proven expertise of showerhead and vaporization technologies developed by AIXTRON over many years. The QXP-8300 combines IP protected innovations in both these areas that will become more critical for successful chip manufacturing in the increasingly challenging sub-30 nanometer generations devices.
According to Dr. Bernd Schulte, Chief Operation Officer at AIXTRON AG, “A tool order from a Taiwan foundry not only validates technology but also the mass-production pedigree of the QXP-8300. With the lowest CoO and CoC versus all competing tools the QXP-8300 delivers a much needed solution to the technical challenges of depositing advanced high-k materials without compromising on productivity.”
With strong interest emerging globally from major global chip manufacturers Dr. Schulte further commented that “AIXTRON is particularly pleased that we have seen more and more customers very keen to utilize the TriJet technology and QXP-8300 platform for next generation DRAM capacitor and Flash applications.”
The term TriJet® is a registered trademark.