The NanoPrep CNC is designed to perform in package die thinning and polishing along with special machining functions for sample preparation. The die thinned and polished by the NanoPrep CNC are suited to all back side procedures such as IR emission microscopy and FIB editing. With optional software and hardware, it may make gaskets and other fixtures for use with RKD Engineering, Nisene and NSC decapsulators. It can also perform mechanical decapsulation, removal of heat spreaders and heat sinks. It provides an easy to use solution for total back-side device preparation. The NanoPrep is a small, specially designed, CNC machining system controlled by a small hand held user interface that allows for the operator to select the desired function and enter the key device measurements. There is no need to know anything about machining or “G Code” to operate the hand held controller although a computer interface is provided that allows “G Code” programming.