Led by laser and motion experts, explore the latest advances in laser drilling of VIA holes — key to enabling higher bandwidth communication and compact device footprints. Attendees will gain insight into methods for overcoming core challenges through fixed-optic configurations, advanced motion control, and laser-to-motion synchronization.
Join our joint webinar on the Latest Advances in Laser Drilling of VIA holes — Featuring Expert Insights from Turner Laser Systems, PI, and ACS.
Matt Price (PI’s Head of Agile Solutions Group), Mark Turner (CEO and Founder of Turner Laser Systems), and Jason Goerges (ACS Motion Control’s VP Marketing) will share real-world examples, including glass wafer drilling, illustrate how these solutions deliver results. To conclude, we’ll preview emerging innovations — such as XL SCAN, 3D error correction, and hybrid piezo motion — that hint at the future potential for even faster and more accurate manufacturing.
Title: Latest Advances in Laser Drilling of VIA holes
Date: July 17, 2025
Time: 2:00 pm (ET)
Register now to secure your spot!
Industries Served
Semiconductor, photonics, optics, medical device manufacturing