Global 450 mm Consortium Selects Entegris Wafer Handling Products

Entegris, Inc. announced that its handling and shipping products for the safe, reliable transport and processing of 450 mm wafers were selected by the Global 450 mm Consortium (G450C), headquartered at SUNY’s College of Nanoscale Science and Engineering (CNSE) in Albany, New York, for use in the development of 450 mm wafer technology.

G450C is a public-private partnership announced by New York Governor Andrew M. Cuomo in September 2011 to facilitate the 450 mm wafer size transition. It is spearheaded by CNSE in partnership with Intel, IBM, GlobalFoundries, Samsung and TSMC. The new 450 mm cleanroom is located at CNSE’s Albany NanoTech Complex within the NanoFab Xtension (NFX) expansion.

The Entegris products selected by the G450C comprise a comprehensive wafer handling solution that includes 450 mm Multiple Application Carriers (MAC), 450 mm Front Opening Pod (FOUP), 450 mm Single Wafer Shippers (SWS), and an innovative packaging system. As part of its agreement with the G450C, Entegris has agreed to provide on-site service which will allow G450C to fully leverage Entegris’ industry recognized expertise in engineering wafer handling solutions, ensuring G450C maximizes efficiency and accelerates the proliferation of 450 mm processes.

Paul Farrar Jr., CNSE Vice President for Manufacturing Innovation and General Manager of G450C, said, “Under the leadership and vision of Governor Andrew Cuomo, New York is firmly established as the hub for the critical industry evolution to 450 mm wafer technology. We look forward to working closely with Entegris and to utilizing its capabilities to help enable the important transition to 450 mm technology.”

Bill Shaner, vice president and general manager for Entegris’ Microenvironments Division, said: “As the industry pioneer in wafer shipping and wafer processing products, it was important for Entegris to collaborate with G450C, which is leading the global transition to 450 mm wafer technology, to provide early solutions for transporting these larger wafers. Our 450 mm development efforts, which began in 2007, have resulted in innovative and differentiated technology that will serve the needs of the industry’s leading companies as they ramp up 450 mm operations.”

The G450C is a public-private partnership program comprised of New York State (CNSE), Intel, TSMC, Samsung, IBM and GLOBALFOUNDRIES that develops cost-effective test wafer fabrication infrastructure, equipment prototypes and high-volume tools to enable a coordinated industry transition to 450mm wafers. The program uses the capabilities established at CNSE for joint development activities and support of a comprehensive industry ecosystem. Additional information can be found at


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