Modular Photonics Alignment System for Fiber-Optics Applications with Higher Loads

Physik Instrumente (PI), a global leader in precision motion control and nanopositioning systems, introduces the F-572 High-Performance 3- to 6-Axis Photonics Alignment System, designed for high-throughput active alignment applications in photonics manufacturing and test.

F-572, 6-DOF high-speed photonics alignment system for loads to 2 kg. Image Credit: PI (Physik Instrumente) LP

The integrated system combines precision goniometers, linear nanopositioning stages, magnetic direct-drive technology, high-resolution optical encoder feedback, and a preconfigured ACS-based alignment controller. It provides a compact, industrial-ready platform for demanding photonics applications with payloads to 2 kg, including advanced packaging, LiDAR, and multichip-level testing.

A user-adjustable magnetic counterbalance on the Z-axis keeps motor currents and heat to a minimum.

The F-572 offers linear travel ranges of 60 mm in X, Y, and Z, while three precision goniometers with a common pivot point provide rotation ranges up to 17 °. High-speed magnetic direct drives enable linear velocities up to 500 mm/s, and the goniometers support angular velocities up to 10 °/s. Minimum incremental motion is 5 nm and 5 µrad for linear and angular motion, respectively, with bidirectional repeatability of 150 nm and 25 µrad.

Embedded Fast Multi-Channel Alignment (FMPA) routines for rapid area scans and gradient searches help reduce alignment times and increase manufacturing throughput.

The included alignment controller features TCP/IP and EtherCAT interfaces, advanced specific alignment routines and user-friendly software. PI’s optional ultrafast PILightning algorithm is available for accelerated first-light search applications.

Industries and Applications Served

Advanced packaging, LiDAR, multichip-level testing, PIC alignment, fiber alignment, photonics test and assembly, optical component assembly, automated photonic wafer testing, photonics wafer probing

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