Nanoelectronic Grade Adhesives - Highly Reliable Formulations for Nanoelectronic Applications

Nanotechnological developments figure prominently when it comes to the electronics industry. The opportunity for improved functionality and performance while simultaneously reducing size and weight make such technologies ideal for the highly demanding uses of electronic applications. Master Bond offers a top notch line of adhesive formulations custom formulated to meet the rising demands of this industry.

Master Bond Inc. provides the adhesive systems required for specific nanoelectronic applications. For example, adhesive to be employed in thermomechanical applications will require a high coefficient of thermal expansion and heat resistant properties in order to resist the standard temperature differentials which accompany such processes. Additionally, depending on the specific use, any system to be employed with SMT applications will most likely require either a low shrink grade, electrically and thermally conductive grade, thermally insulating grade, or a low outgassing grade solution, all some of the many characteristics which Master Bond formulations offer.

The future impact of nanotechnology on electronic memory storage is incalculable. One promising example, a novel application of nanoengineering currently in development promises to replace the standard hard drive with greater data density in a smaller area, yielding unimaginable benefits in a wide range of applications. The developed product has the potential to revolutionize current standards for electronic memory storage, presenting the world with a faster, yet miniaturized version than presently available. In recognition of all the potential which awaits in the realms of nanoelectronic development, Master Bond is at the forefront of technologically advanced adhesive solutions formulated for high quality performance.

Potential Future Sectors for Master Bond Nanoelectronic Grade Adhesives

Potential future sectors for Master Bond nanoelectronic grade adhesives include:

  • Information storage
  • Telecommunications
  • Network systems
  • Programmable logic
  • Signal processing
  • Control systems

Application of Master Bond Adhesives in the Nanoelectronic Industry

Some specific Master Bond applications in the nanoelectronic industry may include:

  • Next generation transistors for high speed solutions
  • Next generation communication devices
  • Advanced semiconductor packaging
  • Adhesive functioning as a thermally conductive medium for semiconductor packaging or other heat prone applications
  • Absorption of external vibrations and impacts in high precision devices
  • Integrated circuitry
  • Microprocessors
  • Embedded capacitors
  • Transistors
  • Diodes
  • Resistors
  • Electronic switches
  • Digital Circuitry
  • Transducer mounting
  • Stress relief bridge bonds
  • Backfilling connectors
  • Potting of sensors
  • Sensor device/OEM Implantation
  • Adhesion to GaAs devices
  • Wire tacking
  • As a dielectric layer in the fabrication of capacitors
  • RFID and smart card assembly
  • Piezoelectric devices
  • Thermistors
  • Bearing cartridge assembly
  • Sealing of electrical modules

High Reliability & Performance

There are many different aspects which factor into the quality and performance of an advanced adhesive system. Being cognizant of specific applications and the variety of considerations which require attention is one method of ensuring optimal performance of adhesive system. Master Bond technical engineers will not leave a stone unturned in ensuring that customers receive the adhesive formulation necessary for their specific application. This combined with the high quality product typical of Master Bond, and it is no wonder that they have earned a reputation for highly reliable adhesive solutions.

Properties Offered by Master Bond Nanoelectronic Grade Adhesives

Specific nanoelectronic grade Master Bond systems offer following properties:

  • High bond strength to similar and dissimilar substrates
  • Thermal Conductivity
  • Electrical conductivity
  • Superior electrical insulation properties
  • Low stress
  • Low outgassing
  • Dimensional stability
  • Low coefficients of thermal expansion
  • High and low temperature serviceability
  • Fast cures at ambient temperatures or slightly elevated temperatures
  • Exceptional durability
  • Easy repairability
  • Chemical Resistance
  • Cryogenic Serviceability
  • High Temperature Resistance
  • Hardness
  • Low Shrinkage
  • Peel Strength
  • Thermal Cycling
  • Shock Resistance
  • Impact Resistance
  • Vibration Resistance
  • Glass Transition Temperature
  • Compressive Strength
  • Tensile Strength
  • Elongation
  • Flexural Strength
  • Outstanding Adhesion to Mismatched CTE's
  • Thermal Stability
  • Exceptional Physical Strength Properties
  • Adjustable Volume Resistivity
  • Low Ionic Impurities
  • Optical Clarity
  • Flame Retardancy / Low Smoke Emission
  • Biocompatibility
  • Abrasion

Custom Formulations

The many potential applications of nanoelectronic grade adhesives make for a very complex selection process; one requiring much research of all relevant considerations. It is for this reason that Master Bond Inc. offers custom formulated adhesive systems, tailor made products possessing the specific properties necessary for successful employment.

Regardless of the specific requirement, adhesive formulations may be adjusted to possess all required characteristics. Boasting a vast array of over 3,000 custom designed adhesive formulations, Master Bond offers adhesive properties which differ in viscosity, cure speed, temperature and chemical resistance, strength, electrical and thermal conductivity.

In addition, Master Bond adhesive systems can withstand the stresses of any hi-tech application, including extreme temperatures, thermal cycling and shock, mechanical forces, vibration, and chemical exposure. Specific adhesive systems can be designed to meet USP Class VI certification for medical use and biocompatibility, NASA requirements for low outgassing, as well as a product with the UL94 V-0 rating for flame retardancy. With Master Bond's unparalleled experience and expertise, they guarantee the development and successful implementation of a customized solution for your nanoelectronic application.

Insights into Nanoengineering by Master Bond Inc.

The main aspect of nanoengineering which makes it such a revolutionary sector of science, and provides it with the potential to shatter the more conventional technologies resides in its offering a fresh approach to practical methods of engineering. Nanotechnologies' "bottom up" process provides engineers with the ability to manipulate molecules on an individual level, essentially allowing for the ultimate in custom design. With the ability to operate on such a high precision basis, nanoengineers take great strides in advancements benefiting all walks of life.

The Master Bond line of nanoelectronic grade adhesive formulations consists of epoxies, silicones, polyurethanes, acrylics and latex solutions, and comes in over 3000 formulations They include electrically insulative, thermally conductive and electrically conductive systems. Significant investments of research and development serve to ensure optimal performance of the Master Bond product line, regardless of application. Master Bond provides innovative solutions to the sometimes troublesome processing issues which may arise in nanoelectronic applications. Be it an intricate circuit design which requires absolute precision processing, or the high heat climate of a semiconductor, anything is possible.

Master Bond is also actively engaged in developing new systems to keep pace with the tremendous developments of the nanotechnological industry. With awareness of manufacturer needs, Master Bond engineers stand on the forefront of chemical adhesive development, providing manufacturers with the quality adhesive they require.

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.


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