This is the exhaustive tool kit for scribing and cleaving cleanly. This process is crucial for creating the highest quality cross-sections. This kit contains two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. This kit can be used for a large range of materials and wafers such as Si, GaAs and glass.
The standard configuration includes one each of the following items:
- Diamond Scribe-Pen style
- Diamond Scribe-Straight tip
- Diamond Scribe-30 degree tip
- Tweezers with black soft fiber fine tip (length 6 ¼”)
- CleanBreak Pliers-Wafer cleaving pliers.
- Small ruler mat-Self healing, Small wafer piece ruler mat
- Clear plastic ruler with metric and US units
- Tungsten cleaving wire