Wafer Bonders

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS) and optoelectronics. Normally, a temporary bond is made with a bonding agent or a permanent bond of oxide film surfaces is made by a self-bonding process. Temporarily bonds are separated after the completion of a vertical electrical connection through a silicon wafer, a sequence known as TSV.

Wafer bonding has become a fundamental core capacity for any high-volume MEMS production facility that makes anything from accelerometers to silicon sensors for automotive, aerospace and consumer devices.