The DXB is used for mounting wafer to substrate improves bond quality and repeatability while improving process time during lapping, polishing, or dicing.
- Wafer Lapping
- Wafer Polishing
- Wafer Dicing
- Any other temporary wafer bonding
DXB provides a controlled bonding environment with even heat and constant pressure in an air-evacuated chamber for bonding semiconductor materials to disposable and reusable substrates.
DXB is designed to bond wafers using WaferGrip Temporary Adhesive. Dynatex International supplies WaferGrip in various preformed shapes and sizes to suit the required application. This along with the accurately controlled bond line provides an efficient and robust process.
DXB bonding chamber is available in two sizes: 11 inches (279 mm) and 5.2 inches (132 mm).The DXB can be used for single or multiple wafer bonding. For example, four four inch wafer can be bonded at one time.