EV Group (EVG), a leading supplier of wafer-bonding and lithography
equipment for the advanced semiconductor and packaging, MEMS,
silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced
the latest addition to its portfolio of products created to optimize the
manufacture of high-brightness light-emitting diodes (HB-LEDs), compound
semiconductors and power electronics.
The new EVG620HBL fully automated mask alignment system builds on EVG's
field-proven mask aligner platform, adding a high-intensity ultraviolet (UV)
light source and five cassette stations – significantly more than competitive
offerings – to enable continuous fabrication of devices. As a result, the
EVG620HBL delivers unparalleled throughput of up to 165 six-inch wafers per hour
(up to 220 wafers per hour in first print mode) with the industry's highest
alignment accuracy and yield.
According to market research firm Global Information, Inc. (Farmington,
Conn.), global consumption of high brightness LEDs (HB-LEDs) will continue to
grow at a rapid pace over the next decade, from $10.09 billion in 2010 to $46.05
billion in 2020. Key drivers will include explosive growth in solid-state and
general lighting applications, as well as signage, professional displays, and
stationary (non-vehicle) signals. To meet this increased demand, HB-LED
manufacturers must quickly ramp up to higher production capacity, as well as
optimize their manufacturing processes to ensure the highest yields – all of
which elevates their need for automated manufacturing solutions with the lowest
cost of ownership.
As with its dedicated EVG560HBL automated wafer-bonding system, introduced
last July, EVG developed the EVG620HBL aligner to address these needs. EVG is
not new to this market – its bonders and mask aligners are being deployed by
four of the top five major HB-LED manufacturers. Building on this success, the
company created the 620HBL in response to customer demand for a mask alignment
system dedicated to meeting these devices' yield and throughput requirements.
Another key feature of the EVG620HBL is the availability of special
recipe-controlled microscopes whose illumination spectrum is optimized to ensure
the best pattern contrast with various wafer and layer materials, including such
advanced substrate materials as sapphire, silicon carbide (SiC), aluminum
nitride (AlN), metal and ceramic.
"Our ongoing R&D efforts and focus on innovation in equipment
manufacturing and process engineering are enabling EVG to consistently deliver
the state-of-the-art, high-volume manufacturing solutions that our customers
expect," stated Paul Lindner, EV Group's executive technology director. "Just
last month, one of the leading HB-LED manufacturers ordered an EVG560HBL bonder,
and the EVG620HBL is the latest result of our ongoing efforts around enabling
HB-LED manufacturers to develop more efficient, cost-effective and higher
yielding devices to meet their customers' demands. We look forward to making
further inroads with this latest offering, which also features high-accuracy
handling and alignment of fragile or warped wafers."