PI (Physik InsAtrumente), a global leader in precision motion control and nanopositioning, has released the A-725, a five-axis air bearing nanopositioning system combining a true planar XY stage with an integrated parallel-kinematics Z-θX-θY module. Designed and manufactured in the USA, the A-725 is built for semiconductor manufacturing, photonics, metrology, microscopy, and precision automation, delivering frictionless motion, exceptional geometric accuracy, and precise multi-axis alignment in a compact footprint.
5-axis air-bearing nanopositioning stage for alignment and metrology applications. Image Credit: PI (Physik Instrumente) LP
Debuting at Photonics West, the system offers XY travel from 100 × 100 mm up to 300 × 400 mm, plus 5 mm of Z travel and ± 2 ° of tip/tilt. A 250 mm platform diameter and up to 8 kg payload capacity make the A-725 well-suited for demanding optical inspection, alignment, laser dicing, and other precision manufacturing tasks.
Low-Profile Planar XY Base Stage
Unlike conventional stacked XY stages, the A-725 is built around PI's A-311 planar air bearing stage where the moving platform glides over a common reference plane in both X and Y. This eliminates stacking errors and minimizes Abbe offsets, significantly improving geometric accuracy, a key advantage over conventional stacked or integrated mechanical-bearing stages.
Parallel-Kinematics 3-Axis Z-Tip-Tilt Module
Mounted directly above the planar stage, PI's low-profile A-523 Z-θX-θY parallel-kinematics module provides precise vertical positioning and angular alignment while keeping a low center of gravity.
Direct-Drive Motors, Turnkey Integration
All five axes use ironless three-phase linear motors, eliminating friction, backlash, cogging, and wear for smooth, high-velocity, low-ripple motion. The A-725 ships fully configured with PI ACS-based controllers and drives, wired, tested, and servo-tuned for each customer's payload - minimizing commissioning time.
Industries Served and Applications
Semiconductor test and manufacture, wafer stealth slicing, optical metrology, photonics alignment, material research, laser processing