TEM Lamella Preparation: Combine Flexibility and Automation using the ZEISS Crossbeam FIB-SEM

TEM lamella preparation is essential for almost any FIB-SEM user. Go beyond conventional TEM sample preparation with the ZEISS Crossbeam FIB-SEM. Users can maximize their productivity for TEM lamella preparation by using a fully automated solution. 

Join this webinar to learn more about the TEM Prep Automation workflow from ZEISS and its benefits for your research. 

Attend This Webinar to Learn How To:

• Save time by automating every step, from chunking to lift-out to thinning, with ZEN Core for TEM Prep Automation. Alternatively, perform the process manually.
• Benefit from a high degree of flexibility in the workflow. Prepare multiple samples and diverse materials.
• Gain efficiency via multisite TEM lamella preparation on various sample types.
• Take advantage of the high repeatability and quality of your lamellas for TEM imaging.

Attend This Webinar If You: 

• Need reproducible TEM lamella for nanoscale studies.
• Analyze diverse materials with automated TEM prep. 
• Optimize lamella workflows for chip characterization.
• Prepare precise lamella for optical structure imaging.
• Seek efficient, flexible TEM sample preparation methods.
• Want clear insights into advanced TEM workflows.

Meet The Webinar Speakers

Martina Heller is an Applications Development Engineer for Nanoscience and Nanomaterials at Carl Zeiss Microscopy GmbH, Germany. She received her Masters degree at the Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU) in Material Science. After receiving her degree, she joined the institute of general material properties at FAU and worked as a research associate. The research focus was Hydrogen embrittlement in iron investigated by Atom Probe Tomography (APT). At Zeiss she is working on developing new applications for Crossbeam Laser and cryo FIB for Nanomaterials.

Prof. Dariusz Jarząbek is a professor at the Institute of Fundamental Technological Research, Polish Academy of Sciences, and the Faculty of Mechatronics at Warsaw University of Technology. His research focuses on the mechanics of materials, with particular emphasis on refractory high-entropy alloys, nano- and micromechanics, and tribology. He has led projects on nitrogen ion implantation, rapid thermal processing of high-entropy coatings, optimization of metal-matrix composites, and the design of advanced AFM probes. His recent work also includes the development of a 3D printing system for refractory high-entropy alloys and innovative measurement tools for micro- and nanomechanics. He is the author of over 40 JCR-indexed publications and several patents in advanced materials and precision instrumentation.