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Topics Covered
Introduction
Potential Future Sectors for Master Bond Nanoelectronic Grade
Adhesives
Application of Master Bond Adhesives in the Nanoelectronic
Industry
High Reliability & Performance
Properties Offered by Master Bond Nanoelectronic Grade Adhesives
Custom Formulations
Insights into Nanoengineering by Master Bond Inc.
Introduction
Nanotechnological developments figure prominently when it comes to the electronics
industry. The opportunity for improved functionality and performance while simultaneously
reducing size and weight make such technologies ideal for the highly demanding
uses of electronic applications. Master
Bond offers a top notch line of adhesive
formulations custom formulated to meet the rising demands of this industry.
Master
Bond Inc. provides the adhesive
systems required for specific nanoelectronic applications. For example,
adhesive to be employed in thermomechanical applications will require a high
coefficient of thermal expansion and heat resistant properties in order to resist
the standard temperature differentials which accompany such processes. Additionally,
depending on the specific use, any system to be employed with SMT applications
will most likely require either a low shrink grade, electrically and thermally
conductive grade, thermally insulating grade, or a low outgassing grade solution,
all some of the many characteristics which Master
Bond formulations offer.
The future impact of nanotechnology on electronic memory storage is incalculable.
One promising example, a novel application of nanoengineering currently in development
promises to replace the standard hard drive with greater data density in a smaller
area, yielding unimaginable benefits in a wide range of applications. The developed
product has the potential to revolutionize current standards for electronic
memory storage, presenting the world with a faster, yet miniaturized version
than presently available. In recognition of all the potential which awaits in
the realms of nanoelectronic development, Master
Bond is at the forefront of technologically advanced adhesive solutions
formulated for high quality performance.
Potential Future Sectors for Master Bond Nanoelectronic Grade Adhesives
Potential future sectors for Master
Bond nanoelectronic grade adhesives include:
- Information storage
- Telecommunications
- Network systems
- Programmable logic
- Signal processing
- Control systems
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Application of Master Bond Adhesives in the Nanoelectronic Industry
Some specific Master
Bond applications in the nanoelectronic industry may include:
- Next generation transistors for high speed solutions
- Next generation communication devices
- Advanced semiconductor packaging
- Adhesive functioning as a thermally conductive medium for
semiconductor packaging or other heat prone applications
- Absorption of external vibrations and impacts in high precision
devices
- Integrated circuitry
- Microprocessors
- Embedded capacitors
- Transistors
- Diodes
- Resistors
- Electronic switches
- Digital Circuitry
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- Transducer mounting
- Stress relief bridge bonds
- Backfilling connectors
- Potting of sensors
- Sensor device/OEM Implantation
- Adhesion to GaAs devices
- Wire tacking
- As a dielectric layer in the fabrication of capacitors
- RFID and smart card assembly
- Piezoelectric devices
- Thermistors
- Bearing cartridge assembly
- Sealing of electrical modules
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High Reliability & Performance
There are many different aspects which factor into the quality and performance
of an advanced adhesive
system. Being cognizant of specific applications and the variety of considerations
which require attention is one method of ensuring optimal performance of adhesive
system. Master
Bond technical engineers will not leave a stone unturned in ensuring that
customers receive the adhesive formulation necessary for their specific application.
This combined with the high quality product typical of Master
Bond, and it is no wonder that they have earned a reputation for highly
reliable adhesive solutions.
Properties Offered by Master Bond Nanoelectronic Grade Adhesives
Specific nanoelectronic grade Master
Bond systems offer following properties:
- High bond strength to similar and dissimilar substrates
- Thermal Conductivity
- Electrical conductivity
- Superior electrical insulation properties
- Low stress
- Low outgassing
- Dimensional stability
- Low coefficients of thermal expansion
- High and low temperature serviceability
- Fast cures at ambient temperatures or slightly elevated
temperatures
- Exceptional durability
- Easy repairability
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- Chemical Resistance
- Cryogenic Serviceability
- High Temperature Resistance
- Hardness
- Low Shrinkage
- Peel Strength
- Thermal Cycling
- Shock Resistance
- Impact Resistance
- Vibration Resistance
- Glass Transition Temperature
- Compressive Strength
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- Tensile Strength
- Elongation
- Flexural Strength
- Outstanding Adhesion to Mismatched CTE's
- Thermal Stability
- Exceptional Physical Strength Properties
- Adjustable Volume Resistivity
- Low Ionic Impurities
- Optical Clarity
- Flame Retardancy / Low Smoke Emission
- Biocompatibility
- Abrasion
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Custom Formulations
The many potential applications of nanoelectronic grade adhesives make for
a very complex selection process; one requiring much research of all relevant
considerations. It is for this reason that Master
Bond Inc. offers custom formulated adhesive
systems, tailor made products possessing the specific properties necessary
for successful employment.
Regardless of the specific requirement, adhesive formulations may be adjusted
to possess all required characteristics. Boasting a vast array of over 3,000
custom designed adhesive formulations, Master
Bond offers adhesive properties which differ in viscosity, cure speed, temperature
and chemical resistance, strength, electrical and thermal conductivity.
In addition, Master Bond
adhesive
systems can withstand the stresses of any hi-tech application, including
extreme temperatures, thermal cycling and shock, mechanical forces, vibration,
and chemical exposure. Specific adhesive
systems can be designed to meet USP Class VI certification for medical use
and biocompatibility, NASA requirements for low outgassing, as well as a product
with the UL94 V-0 rating for flame retardancy. With Master
Bond's unparalleled experience and expertise, they guarantee the development
and successful implementation of a customized solution for your nanoelectronic
application.
Insights into Nanoengineering by Master Bond Inc.
The main aspect of nanoengineering which makes it such a revolutionary sector
of science, and provides it with the potential to shatter the more conventional
technologies resides in its offering a fresh approach to practical methods of
engineering. Nanotechnologies' "bottom up" process provides
engineers with the ability to manipulate molecules on an individual level, essentially
allowing for the ultimate in custom design. With the ability to operate on such
a high precision basis, nanoengineers take great strides in advancements benefiting
all walks of life.
The Master Bond line
of nanoelectronic grade adhesive formulations consists of epoxies, silicones,
polyurethanes, acrylics and latex solutions, and comes in over 3000 formulations
They include electrically insulative, thermally
conductive and electrically
conductive systems. Significant investments of research and development
serve to ensure optimal performance of the Master
Bond product
line, regardless of application. Master
Bond provides innovative solutions to the sometimes troublesome processing
issues which may arise in nanoelectronic applications. Be it an intricate circuit
design which requires absolute precision processing, or the high heat climate
of a semiconductor, anything is possible.
Master Bond is also
actively engaged in developing new systems to keep pace with the tremendous
developments of the nanotechnological industry. With awareness of manufacturer
needs, Master Bond
engineers stand on the forefront of chemical adhesive development, providing
manufacturers with the quality adhesive they require.
Source: Master Bond
For more information on this source please visit Master
Bond.